Matsumi abrasive polishing material will provide your needs.

The "HO" fine powder is the unique wrapping material of alumina quality among artificial abrasives.
A semiconductor particle is mainly used for the core parts in the electronic industrial products.
In order to produce semiconductor particles, HO is made of semiconductor crystal products such as silicon and chemical compound semiconductor.
As a resuilt, even and flat fine-finishing is obtained by this minute wrapping powder.
HO uses carefully selected materials, and it is characteristic of the shape and the hardness for its original processing.
It is the minute wrapping powder of alumina and silica quality.
It has the unique crystal structure, and can grind blades by itself.
It always enables to obtain stable griding, and can decrease scratch also.
It not only is suited for making of semiconductor crystal products, but also for making of lens, prism, glass and crystals.